| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| MT41K512M8DA-107:P | 存储IC |
MICRON/美光 |
BGA |
16+ |
600 |
|||
| MT29F4G08ABADAWP-IT:D | 存储IC |
MICRON/美光 |
TSOP |
15+ |
2000 |
|||
| S3C2450X40-YL40 | 其他被动元件 |
SAMSUNG/三星 |
BGA |
10+ |
3000 |
|||
| K4B4G1646E-BCNB | 存储IC |
SAMSUNG/三星 |
BGA |
18+ |
800 |
|||
| IS42S16400F-6TL | 内存芯片 |
ISSI |
TSOP |
11+ |
1800 |
|||
| S29GL256P90TFCR20 | 逻辑IC |
SPANSION/飞索半导体 |
TSOP |
11+ |
810 |
|||
| K4T51083QG-HCE6 | 其他被动元件 |
SAMSUNG/三星 |
BGA |
10+ |
5120 |
|||
| S3C2443XL-40 | 内存芯片 |
SAMSUNG/三星 |
BGA |
11+ |
1500 |
|||
| HY5DU121622DTP-D43 | 存储IC |
SKHYNIX/海力士 |
TSOP |
10+ |
500 |
|||
| K4B4G0846Q-HYK0 | 存储IC |
SAMSUNG/三星 |
BGA |
14+ |
600 |
|||
| KH25L1605DM2C-12G | KH |
SOP-8 |
09+ |
5000 |
||||
| S29AL008D70TFI020 | 内存芯片 |
SPANSION/飞索半导体 |
TSOP |
10+ |
19200 |
|||
| K4T51083QI-HCE6 | 其他被动元件 |
SAMSUNG/三星 |
BGA |
11+ |
505 |
|||
| W9425G6EH-4 | 其他IC |
WINBOND/华邦 |
TS0P |
10+ |
32600 |
|||
| MT47H64M16HR-25E AIT:H | 内存芯片 |
MICRON/美光 |
BGA |
14+ |
26000 |
|||
| BCM5389KFB | 其他被动元件 |
BROADCOM/博通 |
BGA |
11+ |
900 |
|||
| W9864G2GH-6 | 存储IC |
WINBOND/华邦 |
TSOP |
09+ |
960 |
|||
| MT41K128M16JT-125:K | 存储IC |
MICRON/美光 |
BGA |
17+ |
1500 |
|||
| MTFC4GACAJCN-1M | 存储IC |
MICRON/美光 |
BGA |
17+ |
200 |
|||
| H5PS5162GFR-Y5I | 内存芯片 |
SKHYNIX/海力士 |
BGA |
14+ |
1600 |
商家默认展示20条库存